Global FPC EMI Shielding Film Industry Insights by Type, by Application, by Region, by Players and Forecast of Size and Share from 2024 to 2029

1. FPC EMI Shielding Film Market Overview and Trends

The global FPC EMI Shielding Film market size is $356.67 million in 2024 with a CAGR of 6.14% from 2024 to 2029.

In the 5G era, the application of new technologies such as Massive MIMO and beamforming will effectively improve spectrum efficiency and improve communication quality. However, the significant increase in the number of antennas and the significant reduction in antenna size in high-frequency bands have put forward higher requirements for anti-interference performance, which puts forward new demands on FPC EMI shielding film. It is expected that in the 5G era of each FPC, the area covered by the electromagnetic shielding film and the amount used will continue to increase to better reduce electromagnetic interference. These factors have brought new opportunities to the FPC EMI shielding film market. EMI shielding film can effectively suppress electromagnetic interference, and at the same time can reduce the attenuation of the transmission signal in the FPC, and reduce the incompleteness of the transmission signal. It has become an important raw material for FPC and is widely used in electronic products such as smartphones and tablets.

Global FPC EMI Shielding Film Market Size (M USD)

2. Market Drivers

The demand for electronic products is increasing.

With the improvement of people’s living standards, the demand for electronic products is also increasing day by day, coupled with the continuous innovation of modern electronic products and other factors, which will drive electronic material products, especially the development of FPC EMI shielding film and other high-tech segmented products.  In the future, new electronic materials companies with core technologies and R&D advantages will gradually occupy the market share of international giants relying on product technology advantages and localization advantages, realize import substitution and product upgrades, and enhance the technical level and market position of FPC EMI shielding film-related industries. These factors have also promoted the development of the FPC EMI shielding film market. At present, FPC is widely used in various fields such as consumer electronics, communication equipment, medical equipment, instrumentation, and aerospace. As the electronic information industry becomes more and more important in the national economy, the country will further increase investment in electronic information construction in various fields. The acceleration of electronic information construction in downstream areas will inevitably drive the development of the FPC EMI shielding film industry.

3. Market Limitations

In recent years, downstream electronic products have continuously upgraded their technologies, moving towards lighter, thinner, and more intelligent applications, and have put forward higher requirements for display technology, data transmission, and processing capabilities. High-end electronic materials such as higher-performance electromagnetic shielding film, conductive adhesive film, ultra-thin flexible copper clad laminate, and ultra-thin copper foil are required to provide support. The raw material formula, production process, and quality control of high-end electronic materials such as FPC electromagnetic shielding film are more complicated. Downstream applications put forward higher requirements for products. In addition to meeting shielding effectiveness, they must also meet the requirements of lightness, bending resistance, and high peel strength. Related products do not have general production equipment, and the production process does not have industry standards. It is necessary to produce products with high quality, performance, and stability, and to ensure the yield rate. Enterprises must continuously improve production processes, upgrade and improve key equipment and raw material formulations independently developed. With the advancement of technology and the continuous improvement of product upgrade speed, companies that do not have certain technical strengths, lack technical reserves and have industry experience will not be able to adapt to the development of the market.

4. Market Segment

Among different product types, the Thin Type (8μm-15μm) segment contributes the largest market share in 2024.

Ultra Thin Type (8μm): The ultra-thin FPC electromagnetic shielding film has a total thickness of 8μm, which has excellent sliding and bending properties, and is also suitable for moisture absorption reflow soldering, excellent dimensional stability, and OSP treatment.

Thin Type (8μm-15μm): The thickness of the thin FPC electromagnetic shielding film is 8μm-15μm, which has good manufacturing applicability, high-temperature resistance, chemical resistance, meets environmental protection requirements, and is cost-effective.

Normal Type (Other thickness): Normal Type (Other thickness) FPC EMI Shielding Film means its thickness is greater than 15 microns. FPC EMI Shielding Film with these thicknesses has excellent flexibility in the internal insulating layer and excellent wear resistance in the external insulating layer.

The market size of thin (8μm-15μm) is 177.97 million in 2024, and that of ultra-thin (8μm) is $100.55 million. The reasons for the market growth include product upgrades, technological innovations, and expansion of downstream application industries.

By application, the FPC applications segment occupies the biggest share.

Multi-layer FPC Applications: Multi-layer FPC is to laminate 3 or more layers of single-sided or double-sided flexible circuits together, and form metalized holes by drilling and electroplating to form conductive paths between different layers. In this way, no complicated welding process is required. Multilayer circuits have huge functional differences in terms of higher reliability, better thermal conductivity, and more convenient assembly performance. Electromagnetic shielding film is mainly used in multilayer FPC. With the development of the FPC industry in recent years, the electromagnetic shielding film industry is showing a rapid development trend.

High-speed Signal Transmission FPC Applications: With the increasing expectations and requirements of the public for electronic products, flexible circuit board FPC, one of the main carriers of electronic products, also has higher challenges. High-frequency signal transmission and high-speed digitization are considered to be the inevitable trend of future FPC development. Electromagnetic shielding film is a shielding body made of special materials to limit electromagnetic waves within a certain range so that electromagnetic radiation can be suppressed or attenuated. It is an effective method to suppress electromagnetic interference.

FPC Applications: As a connecting wire in electronic devices, FPC is mainly used to conduct current and transmit signals. When the signal transmission line is distributed in the outermost layer of the FPC, to avoid signal distortion caused by electromagnetic interference during the signal transmission process, the FPC will press a conductive layer (electromagnetic shielding film) after pressing the cover film to shield the outside electromagnetic the role of interference. One of the most common is the FPC used as image signal transmission in digital cameras.

The market size for multilayer FPC applications in 2024 is $138.89 million, high-speed signal transmission FPC applications are $96.22 million, and FPC applications are $121.56 million. The growth of the market is mainly due to the upgrading of electronic products and the increasing demand for high-speed and high-performance FPCS.

Market Size by Segment

5. Regional Market

From 2024-2029, Japan is estimated to witness robust growth prospects.

Japan is the largest revenue market with a market share of 59.60% in 2024. The China market share is 37.09%, ranking second.

The Japanese market has advantages due to its technological advantages, good purchasing power, and high product quality. However, economic development is relatively weak and labor costs are high. Partnerships with emerging market companies and product innovation are opportunities. However, fierce competition from overseas is a potential threat. Japan has advanced technology in the field of electronics and materials science, especially in FPC and EMI shielding technology. Japanese companies have invested heavily in research and development in these areas and have accumulated deep technology. Japan has a strong manufacturing base, especially in electronics and component manufacturing. FPC and EMI shielding films are indispensable components in many electronic devices, so the Japanese market has a high demand for these products. Japan has strict regulations and standards for electromagnetic compatibility of electronic products, which has promoted the development and application of EMI shielding technology, thus forming a mature market. Japanese consumers have high performance and quality requirements for electronic products, which has prompted manufacturers to use high-quality FPC and EMI shielding films to improve product performance. Japan has a complete supply chain system, from raw material supply to manufacturing, to distribution and retail, which facilitates the production and sale of FPC EMI shielding films. Japan’s corporate culture encourages research development and innovation, which helps drive the continuous advancement and product iteration of FPC EMI shielding film technology. Japan is one of the major exporters of electronic products in the world, and the demand for FPC EMI shielding films in its domestic market also reflects the trend and demand of the global market. Japanese society has a high awareness of environmental protection and energy efficiency, which encourages enterprises and consumers to tend to use environmentally friendly and energy-saving electronic products, and FPC EMI shielding films help improve the energy efficiency of electronic products.

Global FPC EMI Shielding Film Market Share by Region in 2024

6. Market Competition

FPC EMI Shielding Film sales companies are mainly from Asia. The industry concentrate rate is high. The top three companies are TATSUTA Electric Wire & Cable, Guangzhou Fang Bang Electronics, and TOYOCHEM with a revenue market share of 79.52% in 2024.

One of the important conditions for FPC manufacturers to choose suppliers is stable supply capacity. The lack of sufficient production capacity not only affects the ability of enterprises to grasp business opportunities but also affects the closeness of cooperation between enterprises and large FPC manufacturers. From the perspective of raw material procurement, the larger the production scale of an enterprise, the more favorable it is to negotiate with raw material suppliers. FPC EMI shielding film companies are small in the initial stage of development, and the upstream and downstream cooperation is not close enough, they are often at a disadvantage in negotiations with raw material suppliers, it is difficult to effectively control procurement costs, and they are at a disadvantage in industry competition.

TATSUTA Electric Wire & Cable: TATSUTA ELECTRIC WIRE AND CABLE CO., LTD. is mainly engaged in the manufacture and sale of electric wires, cables, and related products. The Company operates its business through two business segments. The Electric Wire and Cable segment includes the telecommunication wire business, which manufactures and sells wires for infrastructure and general industrial machinery, and the equipment wire business, which manufactures and sells wires for factory automation and precision industrial machinery. TATSUTA Electric Wire & Cable is one of the major players operating in the FPC EMI Shielding Film market, holding a share of 52.68% in 2024.

Guangzhou Fang Bang Electronics: Guangzhou Fang Bang Electronics was founded in Guangdong in December 2010. It is China’s first research and development, production, sales, and service of new materials such as electromagnetic shielding film, conductive adhesive, ultra-thin flexible copper clad laminate, and ultra-thin peelable copper foil. As an integrated high-tech enterprise.

TOYOCHEM: Toyochem Co., Ltd. was founded in 2011. The company’s line of business includes the manufacturing of paints, varnishes, lacquers, enamels, and other allied products.

Major Players