Global and Regional DBC Ceramic Substrate Market Status and Trends from 2024 to 2029 Based on Type, Application, and Player

1. DBC Ceramic Substrate Market Trends

The global DBC Ceramic Substrate market sales will reach 120088.3 K PCS in 2024 with a CAGR of 10.14% from 2024 to 2029.

Growing demand for nanotechnology and high-end computing systems. DBC ceramic substrates have a wide range of applications in the electrical and electronic fields. The increasing use of semiconductors, micromachining, and surface science creates new growth opportunities for the DBC ceramic substrate market. Nanomaterials, nanopillars, nanoparticles, nanorods, etc., are used in medicine, space, energy, and electricity. All these applications require ceramic substrates because of their high wear resistance, high temperature resistance, and corrosion resistance. All these factors provide growth opportunities for the DBC ceramic substrate market.

Global DBC Ceramic Substrate Market Sales (K PCS ) in 2024

2. Market Driving Forces

The growth of the consumer electronics industry

The consumer electronics industry involves devices intended for daily use, most commonly used in entertainment and communication devices. Ceramic substrates are consumer electronics’ most versatile and cost-effective thick film technology. Printed thick film ceramic substrates are used in circuit games, membrane touch switches, digital product lighting, and signage. Multilayer ceramic substrates are widely used in digital cameras because they help reduce the volume of printed circuit boards, thereby significantly reducing size and cost. Since miniaturization is a key capability of ceramic substrates, they are also used in hearing aids/headphones that require compact packaging. The mass production of mobile consumer products such as smartphones, tablet computers, notebook computers, desktop computers, set-top boxes, cameras, and headphones may affect the DBC ceramic substrate market.

3. Market Limitation

The price fluctuation of substrate raw materials is one of the major factors limiting the growth of the global direct bonded copper ceramic substrate market. The instability of raw material costs may affect the price and market competitiveness of the final product. The relative scarcity of high-quality and affordable products in the market has limited the expansion of the market. Due to the limited supply of quality products, it may affect the growth rate of the market. The ceramic substrate is used in the packaging process.

If a fault occurs after the device package is completed, it cannot be repaired, and only the entire device can be replaced. Therefore, downstream customers are cautious and strict in the selection and certification of ceramic substrates. Especially in the automotive and military fields, the testing of the aging resistance, extreme environment resistance, and strength performance of the ceramic substrate need to be carried out for thousands of hours, and the cycle is as long as six months to one year. With the increasingly stringent environmental regulations, the production process of direct-bonded copper ceramic substrates needs to pay more attention to environmental protection and sustainability, which may increase production costs and complexity.

4. Market Segment

Among different product types, the Al2O3 DBC Ceramic Substrate segment is anticipated to contribute the largest market share in 2024.

AlN DBC Ceramic Substrate: AlN has two very important performances: one is the high thermal conductivity, an expansion coefficient matching with Si. The disadvantage is that even the surface of a very thin oxide layer will also affect the thermal conductivity, the only strict control is to create a better substrate for AlN materials and process.

Al2O3 DBC Ceramic Substrate: Alumina substrate is the most commonly used substrate material in the electronic industry because of its mechanical, thermal, and electrical properties compared to most other oxide ceramics, high strength and chemical stability, and a rich source of raw materials, manufacturing technology and application in a wide variety of different shapes. At present, alumina substrate has been 3D custom.

The AlN DBC ceramic substrate market will continue to grow, with the market share expected to increase from 23.67% in 2020 to 25.26% in 2024. Reasons for this growth may include its excellent thermal conductivity and an expansion coefficient that matches silicon. As the most commonly used ceramic substrate material, the market share of Al2O3 DBC ceramic substrate is expected to decrease from 64.51% in 2020 to 62.83% in 2024, which may be related to market competition and the emergence of new materials.

By application, the IGBT Modules segment occupies the biggest share in 2024.

Based on applications, IGBT Modules, Automotive, Home Appliances, CPV, Aerospace, and Others.

IGBT power devices, as the largest application area, are expected to have a slight decline in market share but still dominate with a share of 40.11% in 2024. The reason for the growth may be related to the increased demand for new energy vehicles and industrial automation. The automotive segment is also expected to continue to grow, especially with the development of electric and hybrid vehicles.

IGBT module plays an important role in power electronic equipment such as power conversion, inverter, and rectifier, which can realize efficient conversion and control of electric energy. The development trend of IGBT module technology includes no welding, no lead bonding, and no liner/substrate packaging technology; Internal integrated temperature sensor, current sensor and drive circuit, and other functional components, and constantly improving the power density, integration, and intelligence of IGBT module.

Market Sales and Share by Segment

5. Regional Market

Geographically, Asia-Pacific holds the largest market share in 2024.

North America: The North American market has an important position in the global direct bonded copper ceramic substrate market, and technological advances are one of the key factors driving the growth of the North American market, especially the direct bonded interconnect technology related to high performance and low-cost microelectronics applications. In addition, rapid industrialization and increased manufacturing activities are also driving the demand for DCB substrates.

Asia-Pacific: The Asia-Pacific region, especially China, South Korea, and Japan, is the main consumer market for direct bonded copper ceramic substrates, and China occupies an important share in the Asia-Pacific region and even the global market. The growth in the Asia-Pacific region is mainly due to the rapid industrialization process in the region and the development of the manufacturing industry, especially in China, which are driving the demand for high-performance electronic packaging materials. In addition, the rapid development of emerging industries such as new energy vehicles and smart grids has also provided growth momentum for the direct-bonded copper ceramic substrate market.

Europe: The European market also has a presence in the global direct-bonded copper ceramic substrate market, especially in countries such as Germany, the United Kingdom, France, and Italy. Technological advancements and the growing demand for high-density printed circuit boards (PCBS) and consumer electronic devices are driving the growth of the European market. Europe has certain advantages in the field of semiconductor manufacturing and related technologies, which also promotes the development of the direct bonded copper ceramic substrate market.

Global DBC Ceramic Substrate Market Share by Region in 2024

6. Market Competition

DBC Ceramic Substrate companies are mainly from Asia and the United States and the industry concentration is very high. The top three companies are Rogers, Tong Hsing, and NGK Electronics Devices with a revenue market share of 58.36% in 2024.

Rogers: Rogers Corporation manufactures and markets specialty materials and components for applications in the communications, computer, imaging, consumer, and transportation markets. The Company’s products include elastomers, high-frequency circuit materials, flexible circuit materials, molding materials, and composite materials. Rogers sells its products around the world. Rogers curamik® product suite offers best-in-class metalized ceramic substrates that enable higher power efficiency. The curamik® substrates consist of pure copper bonded or brazed to a ceramic substrate and are designed to carry higher currents, provide higher voltage isolation, and operate over a wide temperature range.

Ferrotec: Ferrotec (China) has more than 20 years of DBC production experience, strict product quality testing standards, and can provide products with different parameters according to customer requirements. Widely used in semiconductor refrigerators, electronic heaters, high-power power semiconductor modules, power control circuits, power hybrid circuits, smart power components, high-frequency switching power supplies, solid state relays, automotive electronics, solar panel components, telecommunications dedicated switches, Receiving systems, laser and many other industrial electronic fields.

Tong Hsing: Tong Hsing Electronic Industries, Ltd. manufactures and markets RF (Radio Frequency) IC (Integrated Circuit) modules, multichip IC modules, and ceramic circuit boards.

NGK Electronics Devices: NGK Electronics Devices is actively creating innovations in the electronics industry where dynamic change and continual diversification are the norm. The company’s main products, multilayer ceramic packages for quartz/crystal devices, MEMS, and optical/high-frequency devices, are indispensable components for personal computers, mobile devices, digital consumer electronics, mobile phone base stations, and optical communication systems.

KCC: KCC Corporation manufactures paint and related products, building materials such as cement corrugated sheets, glass wool mats, board and pipe covers, PVC window profiles, paints, and ceramic fiber for high-temperature applications. The Company also produces various glasses such as glass fiber, float glass, patterned glass, safety tempered glass, and long glass fibers.

7. Market Recent Development

Rogers Corporation officially opened its new production facility for curamik® high power semiconductor ceramic substrates in Suzhou. The project plans a total investment of 100 million US dollars, and is expected to achieve full delivery in the middle of 2025, the future production after the annual revenue of up to 200 million US dollars.

KCC Group has fully acquired Momentive, a global high-end silicone and specialty materials company, and minority shareholder SJL Partners, LLC has exited.

Major Players